NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8275CZQMIBA
Package Description:    FPBGA 516 27*27*1.25P1.0
Tracking Number:   K10774D021


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate, Halogen-free  BT MCL-E-679FGB  RoHS CoA
  SOLDER MASK AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request