NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8323EZQADDC
Package Description:    PBGA-PGE 516 27SQ1.25P1
Tracking Number:   K11138D005


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate, Halogen-free  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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