NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8343ECZQAGDB
Package Description:    PBGA 620 29*29*1.2P1.0
Tracking Number:   K11038D034


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Heat Spreader    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  AUS308  RoHS CoA
  E679FGB  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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