NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8347EVVAJDB
Package Description:    TBGA 672 35*35*1.5P1.0
Tracking Number:   K11016D011


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate, Halogen-free  TSA-67  RoHS CoA
  AUS-21  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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