NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8358EVVAGDGA
Package Description:    TBGA740 37.5*37.5*1.69P1
Tracking Number:   K11210D005


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate, Halogen-free  TSA-67  RoHS CoA
  AUS-21  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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