NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC859TVR133A
Package Description:    PBGA 357 25*25*1.2P1.27
Tracking Number:   K10790D030


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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