NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC870ZT133
Package Description:    PBGA 256 23*23*1.22P1.27
Tracking Number:   K10792D024


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  INK  RoHS CoA
  BT  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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