NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC875CZT133
Package Description:
PBGA 256 23*23*1.22P1.27
Tracking Number:
K10792D024
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
INK
RoHS CoA
BT
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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