NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC885CVR133
Package Description:    PBGA 357 25*25*1.2P1.27
Tracking Number:   K10790D035


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  BT-MCL-E-679FGB  RoHS CoA
  SOLDER MASK-AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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