NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC885VR66
Package Description:
PBGA 357 25*25*1.2P1.27
Tracking Number:
K10790D035
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
BT-MCL-E-679FGB
RoHS CoA
SOLDER MASK-AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
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