NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MRF8P23080HSR3
Package Description:    NI-780HS-4 6 Die
Tracking Number:   K11239D004


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Aluminum    RoHS CoA
Cap/Cover  EPOXY  RoHS CoA
  SUBSTRATE  RoHS CoA
Header Assembly    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
Silicon Semiconductor Die    RoHS CoA
    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request