NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
P1011NSE2FFB
Package Description:
29SQ-GRD-DPOP TEPBGA-PGE
Tracking Number:
K11235D032
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Heat Sink
RoHS CoA
Non-Conductive Epoxy/Adhesive
RoHS CoA
Organic Substrate, Halogen-free
E679FGB
RoHS CoA
AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Pb Free, Sn/Ag
RoHS CoA
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