NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    P1012NXN2HFB
Package Description:    29SQ-GRD-DPOP TEPBGA-PGE
Tracking Number:   K11235D032


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Heat Sink    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  AUS308  RoHS CoA
  E679FGB  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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