NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
P1017NSN5HFB
Package Description:
TEPBGA 457 19SQ 1.9 0.8
Tracking Number:
K10949D365
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
E679FGB
RoHS CoA
AUS 308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Lead Free
SAC305
RoHS CoA
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