NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    P1023NSE5CFB
Package Description:    TEPBGA 457 19SQ 1.9 0.8
Tracking Number:   K10949D365


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free  SAC305  RoHS CoA


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