NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    P2020NXN2KHC
Tracking Number:   K11235D034


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Heat Sink    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  PSR-4000 AUS308(UL:PSR-4000EY)  RoHS CoA
  GLASS EPOXY PREPREG/COPPER CALD LAMINATE  RoHS CoA
  PHP-900 IR-6  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request