NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    P3041NXE1MMB
Package Description:    36SQ-GRID WITH-LID
Tracking Number:   K50008S269


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Die Encapsulant, Filler    RoHS CoA
Heat Spreader    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS703  RoHS CoA
  GX-13  RoHS CoA
  PHP-900  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request