NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S912XDG256F1MAG
Package Description:    LQFP 144 20*20*1.4P0.5
Tracking Number:   K00023D167


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request