NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S912XEP768J5MAL
Package Description:
FREE 1.0F CU JEDEC
Tracking Number:
K00006D002
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
AG SPOT PLATE
RoHS CoA
RoHS CoA
CDA 194
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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