NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S912XET256BCAG
Package Description:
FREE 1.0F JEDEC/EIAJ
Tracking Number:
K00023D179
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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