NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S912XET256J2MAG
Package Description:    LQFP 144 20*20*1.4P0.5
Tracking Number:   K00023D168


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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