NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S9S08AW8AE0MLC
Package Description:    LQFP 32 7*7*1.4P0.8
Tracking Number:   K00010D060


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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