NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08DN32F2VLFR
Package Description:
FREE 1.0F CU JEDEC
Tracking Number:
K00009D016
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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