NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08DZ32F2MLCR
Package Description:
FREE 1.0F CU JEDEC
Tracking Number:
K00010D019
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
CDA 7025
RoHS CoA
AG PLATING
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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