NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08SG16E1CTL
Package Description:
TSSOP 28 4.4*9.7*0.9P.65
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
High Pb Sn/Ti/W Bumps
RoHS CoA
Lead Frame Plating
RoHS CoA
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