NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08SG16E1VTJR
Package Description:
TSSOP 20 4.4*6.5*1.P.65
Tracking Number:
K50005S192
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
High Pb Sn/Ti/W Bumps
RoHS CoA
Lead Frame Plating
RoHS CoA
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