NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S9S08SG32E1CTL
Package Description:    TSSOP 28 4.4*9.7*0.9P.65


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
Lead Frame Plating    RoHS CoA


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