NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S9S08SG8E2MTGR
Package Description:    TSSOP 16 4.4*5*1.0P0.65
Tracking Number:   K50005S200


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
Lead Frame Plating    RoHS CoA


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