NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08SL16F1CTJ
Package Description:
TSSOP 20 4.4*6.5*1.P.65
Tracking Number:
K50005S177
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Questions or additional information on a RoHS CoA report, please enter a service request