NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S9S08SL16F1CTJ
Package Description:    TSSOP 20 4.4*6.5*1.P.65
Tracking Number:   K50005S177


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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