NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    S9S12DG25J4CPVE
Package Description:    FREE 1.0F CU JEDEC
Tracking Number:   K00006D055


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame  CDA 194  RoHS CoA
  AG SPOT PLATE  RoHS CoA
    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request