Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
Bonding Wire |
|
RoHS CoA
|
Die Encapsulant |
|
RoHS CoA
|
Non-Conductive Epoxy/Adhesive |
|
RoHS CoA
|
Organic Substrate |
E679FGB |
RoHS CoA
|
|
AUS 308 |
RoHS CoA
|
Silicon Semiconductor Die |
|
RoHS CoA
|
Solder Balls - Pb Free, Sn/Ag |
|
RoHS CoA
|