NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
SPC5553MZQ80
Package Description:
PBGA 324 23*23*1.25P1.0
Tracking Number:
K00073D071
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
BT
RoHS CoA
INK
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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