NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    SPC5634MF1MMG80
Package Description:    16*16 GRID 4OUTR 4INNR
Tracking Number:   K00090D105


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request