NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    SPC5634MF2MMG80
Package Description:    16*16 GRID 4OUTR 4INNR
Tracking Number:   K00090D166


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  MCL-E-679FGB  RoHS CoA
  AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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