NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    SPC5675KFF0VMS2
Package Description:    MAP 473 19*19*1.6 P0.8
Tracking Number:   K00153D029


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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