NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
T4081NXN7TTB
Package Description:
44SQ BALL GRID with LID
Tracking Number:
K50008S267
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Agent
RoHS CoA
Die Encapsulant, Filler
RoHS CoA
Heat Spreader
RoHS CoA
Organic Substrate
ABF-GX13
RoHS CoA
PHP-900
RoHS CoA
AUS410
RoHS CoA
Pb-free Bumped Semiconductor Die
BUMP 6
RoHS CoA
TSMC 12
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
Underfill
RoHS CoA
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