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Design Center
Training
The Future is phyFLEXible - Scalability Reinvented for NXP i.MX 9 Series

The Future is phyFLEXible - Scalability Reinvented for NXP i.MX 9 Series

About This Training

Learn how PHYTEC and NXP help you design resilient, future-ready embedded systems using phyFLEX System-on-Modules (SOMs) and FPSC (Future Proof Solder Core) for NXP’s i.MX 9 Series. This session explores strategies to simplify design, reduce lifecycle risks, and adapt to technology shifts without compromise.

With over 40 years of experience, PHYTEC’s approach ensures flexibility and reliability through a common, swappable footprint—empowering you to manage change and prepare your next embedded device for success.

Presentation

What You Will Learn

How phyFLEX SOMs and FPSC technology enable adaptable, future-proof embedded designs
Strategies to reduce lifecycle risks and manage component availability challenges
Best practices for simplifying design and accelerating development with NXP i.MX 9 Series
How PHYTEC’s common, swappable footprint supports flexibility and long-term reliability
Real-world examples of embedded solutions that stay resilient amid technology shifts