Presented by
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Senior Director i.MX Processors, NXP Semiconductors
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Product Marketing Manager, Tria
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English
In fast-moving markets such as industrial automation, robotics, and medical technology, companies must develop powerful, computation-driven products quickly—often with limited budgets, low design risk tolerance, and long lifecycle requirements. However, many teams struggle to meet these demands, leading to delays, cost overruns, or products that fail to meet expectations.
This webinar explores how a modular approach can simplify development and reduce project risk. Rather than designing complex chip-down solutions, companies can leverage ready-to-use, standardized OSM modules that integrate the CPU, DRAM, and Flash into a single, production-proven platform that has already been validated for deployment.
By adopting OSM, developers and decision-makers can significantly accelerate time-to-market, reduce design costs, and focus on their core competencies, such as application and interface development. We will also highlight how Tria Technologies’ broad OSM portfolio, in-house production, and Avnet-backed supply chain ensure reliability, scalability, and long-term availability.
Not sure you can join? You should still register! Slides and a recording of the session will be available after the webinar.
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