OL-NVT4556UK: WLCSP


Overview

wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.205 mm x 1.605 mm x 0.272 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 1.205 x 1.605 x 0.272 12
Manufacture Code Reference Codes Issue Date
WLCSP12 2014-04-22
Part Description Quick access
SIM card interface level translator with I2C-bus control and LDO
SIM card interface level translator with I2C-bus control and LDO