OL-NX3P191: WLCSP

Overview

Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX3P191	WLCSP	surface mount	bottom	UC	0.76 x 0.76 x 0.51	4	other

Manufacture Code	Reference Codes	Issue Date
WLCSP4	---(EIAJ);---(JEDEC);---(IEC	2011-06-10

Products

Part	Description	Quick access
NX3P191UK	Logic controlled high-side power switch	View parametrics