OL-NX3P2902B: WLCSP


Overview

wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 0.77 x 0.77 x 0.51 4 other
Manufacture Code Reference Codes Issue Date
WLCSP4 ---(EIAJ);---(JEDEC);---(IEC) 2013-04-02
Part Description Quick access