OL-NX5P2924C_NX5P2924D_NX5P2925C: WLCSP

Overview

wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX5P2924C_NX5P2924D_NX5P2925C	WLCSP	surface mount	bottom	UC	0.87 x 1.37 x 0.50	6	plastic

Manufacture Code	Reference Codes	Issue Date
OL-NX5P2924C_NX5P2924D_NX5P2925C		2014-10-16