OL-NX5P2925C: WLCSP


Overview

wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 0.87 x 1.37 x 0.50 6 plastic
Manufacture Code Reference Codes Issue Date
OL-NX5P2925C 2015-04-21
Part Description Quick access