OL-PN550: WLCSP

Overview

wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-PN550	WLCSP	surface mount	bottom	UC	3.29 x 3.29 x 0.54	49	plastic

Manufacture Code	Reference Codes	Issue Date
OL-PN550		2015-08-06

Related Documents

Name/Description	Type	Modified Date
wlcsp49_pn550_fr  PDF	Supporting Information	2015-08-13