OL-TFA9882UK: WLCSP


Overview

WLCSP9: wafer level chip-size package; 9 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.49 x 1.27 x 0.6 9 other
Manufacture Code Reference Codes Issue Date
WLCSP9 ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26