OL-TFA9897C: WLCSP


Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.06 x 2.72 x 0.525 30 plastic
Manufacture Code Reference Codes Issue Date
OL-TFA9897C 2015-05-07