OL-TFA9897C: WLCSP

Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TFA9897C	WLCSP	surface mount	bottom	UC	2.06 x 2.72 x 0.525	30	plastic

Manufacture Code	Reference Codes	Issue Date
OL-TFA9897C		2015-05-07