SOT1385-2: WLCSP9

Overview

WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1385-2	WLCSP9	surface mount	bottom	WLCSP	1.49 x 1.49 x 0.555	9

Manufacture Code	Reference Codes	Issue Date
98ASA01215D		2018-03-06