SOT1401-2: WLCSP25

Overview

WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1401-2	WLCSP25	surface mount	bottom	WLCSP	2.27 x 2.17 x 0.62	25

Manufacture Code	Reference Codes	Issue Date
98ASA00848D		2017-05-12