SOT1401-3: WLCSP25

Overview

WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1401-3	WLCSP25	surface mount	bottom	WLCSP	2.555 x 2.525 x 0.368	25

Manufacture Code	Reference Codes	Issue Date
ASA00848D		2017-05-12

Related Documents

Name/Description	Type	Modified Date
98ASA00848D, WLCSP, 2.27x2.17x0.62, Pitch 0.4, 25 Pins  PDF	Package Information	2016-03-16