SOT1401-3: WLCSP25


Overview

WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP25 surface mount bottom WLCSP 2.555 x 2.525 x 0.368 25
Manufacture Code Reference Codes Issue Date
98ASA00848D 2017-05-12

Related Documents

Name/Description Type Modified Date
Package Information 2016-03-16