SOT1403-1: WLCSP34

Overview

wafer level chip-scale package, 34 bumps, 0.4 mm pitch, 2.45 mm x 2.87 mm x 0.38 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1403-1	WLCSP34	surface mount	bottom	WLCSP	2.45 x 2.87 x 0.38	34

Manufacture Code	Reference Codes	Issue Date
SOT1403-1		2016-08-08

Products

Part	Description	Quick access
NXH3670UK		View parametrics