SOT1403-1: WLCSP34


Overview

wafer level chip-scale package, 34 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP34 surface mount bottom WLCSP 2.45 x 2.87 x 0.38 34
Manufacture Code Reference Codes Issue Date
SOT1403 2016-08-08
Part Description Quick access